Buried
Passives Resistors * Capacitors * Bulk Capacitance |
 |
Compunetics |
| Chip
Carriers and Multi-Chip Modules HDI * Multi-Tiered Cavity * MCM-L |
|
Compunetics |
| Flex
and Chip on Flex Flex-HDI * Bumplets * Military |
|
Compunetics |
| Fine
Lines & Microvias Blind * Buried * Laser Drilled * 25 Microns |
|
Compunetics |
High
Speed Materials |
|
Compunetics |
| Rigid
Flex High Layer Count * High Speed * HDI |
|
Compunetics |