Improved Noise Suppression via MultiLayer Ceramic Capacitors in Power-Entry Decoupling

A new decoupling technique is proposed for surface mounted designs that recommends using 0.1 μF MLCs as the circuit-level decoupling capacitors and 1.0 μF to 10 μF MLCs in place of the tantalum as the board-level power-entry capacitor. This combination of MLCs on each PCB coupled with a single system level tantalum or aluminum is probably an optimum arrangement; performance is enhanced, and cost is not increased