LICA Flip-Chip Application Notes

The rapid changes occurring in the semiconductor industry are requiring new performance criteria of their supporting components. One of these components is the decoupling capacitor used in almost every circuit design. As the integrated circuits have become faster and denser, the application design considerations have created a need to redefine the capacitor parameters and its performance in high-speed environments. Faster edge rates; larger currents, denser boards and spiraling costs have all served to focus upon the need for better and more efficient decoupling techniques.